PRODUCTS
Products
Bumping ＆ WLP
Product size
8~12inch
Application
Bumping ＆ WLP
BGA Package
Product size
22.5×25.3mm
Application
BGA Package
QFN/QFP Lead Frame Package
Product size
1.1×0.7~12.3x12.3mm；
Application
QFN/QFP Lead Frame Package
Flip-Chip
Product size
28nm~5nm；
Application
Flip-Chip
SiP（System in Package）
Product size
2×1.6 ~50~52mm
Application
SiP（System in Package）
Follow us
Address： NO.22 Xingshun road.Yuyao City，Zhejiang province
Consultation hotline： 0574-58121888
Email：zhengquanbu@forehope-elec.com